ELECTRODAG 976SSHV電子組裝/ELECTRODAG 976SSHV電子組裝/ELECTRODAG 976SSHV電子組裝/ELECTRODAG 976SSHV電子組裝/ELECTRODAG 976SSHV電子組裝/ELECTRODAG 976SSHV電子組裝/ELECTRODAG 976SSHV電子組裝/ELECTRODAG 976SSHV電子組裝/ELECTRODAG 976SSHV電子組裝/ELECTRODAG 976SSHV電子組裝/ELECTRODAG 976SSHV電子組裝/ELECTRODAG 976SSHV電子組裝/ELECTRODAG 976SSHV電子組裝/ELECTRODAG 976SSHV電子組裝/ELECTRODAG 976SSHV電子組裝/ELECTRODAG 976SSHV電子組裝/ELECTRODAG 976SSHV電子組裝/ELECTRODAG 976SSHV電子組裝/ELECTRODAG 976SSHV電子組裝/工業膠水/電子組裝膠水/工業用膠
技術服務熱線：021-51693135 / 021-22818476
Electrodag 976SSHV is designed for use in theproduction of rigid printed circuit boards.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Solids Content, % 76 to 80
Viscosity, Brookfield , mPa•s (cP):
Speed 20 rpm, @ 20oC 25,000 to 35,000
Density, kg/cm3 2,700
Theoretical coverage, m2/kg:
@ 10μm dry coating thickness 18
Shelf Life @ 4 to 8oC , year:
From date of qualification in original seal 1
Flash Point , oC 100
TYPICAL SCREEN PRINTING PROCESS
Emulsion Thickness
Direct emulsion when printing conductive jumpers 20 to 40
Capillary film for through-hole metallization 50 to 70
Recommended Squeegee
Polyurethane , Shore Hardness 60 to 75
Recommended Screen Type
Monofilament polyester & Stainless Steel , threads/cm 40 to 110 The above cure profile is a guideline recommendation. Cureconditions (time and temperature) may vary based oncustomers' experience and their application requirements, aswell as customer curing equipment, oven loading and actualoven temperatures. Storage Store product in the unopened container in a dry location.Storage information may be indicated on the product containerlabeling.Optimal Storage: 4 to 8 °C
Electrodag 976SSHV設計用于生產剛性印刷電路板。
固化材料的典型特性
固含量，％76〜80
粘度，布魯克菲爾德，mPa•s（cP）：
速度20 rpm，@20oC25,000至35,000
密度，kg /cm32,700
理論覆蓋率，m2/ kg：
@10μm干涂層厚度18
保質期4至8oC，年：
從原始印章資格之日起1
閃點，oC100
典型屏幕印刷工藝
乳液厚度
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