ECCOBOND XCE3111電子組裝/ECCOBOND XCE3111電子組裝/ECCOBOND XCE3111電子組裝/ECCOBOND XCE3111電子組裝/ECCOBOND XCE3111電子組裝/ECCOBOND XCE3111電子組裝/ECCOBOND XCE3111電子組裝/ECCOBOND XCE3111電子組裝/ECCOBOND XCE3111電子組裝/ECCOBOND XCE3111電子組裝/ECCOBOND XCE3111電子組裝/ECCOBOND XCE3111電子組裝/ECCOBOND XCE3111電子組裝/ECCOBOND XCE3111電子組裝/ECCOBOND XCE3111電子組裝/ECCOBOND XCE3111電子組裝/ECCOBOND XCE3111電子組裝/ECCOBOND XCE3111電子組裝/ECCOBOND XCE3111電子組裝/ECCOBOND XCE3111電子組裝/ECCOBOND XCE3111電子組裝/ECCOBOND XCE3111電子組裝/ECCOBOND XCE3111電子組裝/工業膠水/電子組裝膠水/工業用膠
技術服務熱線：021-51693135 / 021-22818476
樂泰 ABLESTIK XCE 3111 one component adhesive isdesigned for die strap to antenna attach of RFID inlayapplications. It is suitable for reel-to-reel production lines andhigh speed jetting or printing applications and allowsexceptional fine pitch resolution.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Brookfield - Cone & Plate, 25 °C, mPa•s (cP):
Plate 4cm @ Shear rate 30 s
-1 18,000
Shear Thinning Index 5.1
Pot life , days 2
Shelf Life @ -40°C, days 183
Flash Point - See SDS
TYPICAL CURING PERFORMANCE
Cure Schedule
10 seconds @ 110°C at bondline
The cure speed of the product will depend on the efficiency andeffectiveness of the heat transfer method used to cure the adhesive.
The product can also be cured in a convenction oven for longer time.Material properties, however, will depend on the cure condition used.
The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based on customers'experience and their application requirements, as well as customercuring equipment, oven loading and actual oven temperatures.
Storage Store product in the unopened container in a dry location.Storage information may be indicated on the product containerlabeling.Optimal Storage : -40 °C
樂泰 ABLESTIK XCE 3111單組分膠粘劑設計用于芯片貼帶與RFID嵌體的天線連接應用程序。適用于卷軸到卷軸生產線和高速噴射或打印應用和允許特殊的細間距分辨率。
固化材料的典型特性
粘度，布魯克菲爾德 - 孔和板， |
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