ECCOBOND S-3869電子組裝/ECCOBOND S-3869電子組裝/ECCOBOND S-3869電子組裝/ECCOBOND S-3869電子組裝/ECCOBOND S-3869電子組裝/ECCOBOND S-3869電子組裝/ECCOBOND S-3869電子組裝/ECCOBOND S-3869電子組裝/ECCOBOND S-3869電子組裝/ECCOBOND S-3869電子組裝/ECCOBOND S-3869電子組裝/ECCOBOND S-3869電子組裝/ECCOBOND S-3869電子組裝/ECCOBOND S-3869電子組裝/ECCOBOND S-3869電子組裝/ECCOBOND S-3869電子組裝/ECCOBOND S-3869電子組裝/ECCOBOND S-3869電子組裝/ECCOBOND S-3869電子組裝/ECCOBOND S-3869電子組裝/ECCOBOND S-3869電子組裝/ECCOBOND S-3869電子組裝/ECCOBOND S-3869電子組裝/ECCOBOND S-3869電子組裝/ECCOBOND S-3869電子組裝/ECCOBOND S-3869電子組裝/ECCOBOND S-3869電子組裝/ECCOBOND S-3869電子組裝/ECCOBOND S-3869電子組裝/ECCOBOND S-3869電子組裝/ECCOBOND S-3869電子組裝/ECCOBOND S-3869電子組裝/ECCOBOND S-3869電子組裝/ECCOBOND S-3869電子組裝/工業膠水/電子組裝膠水/工業用膠
技術服務熱線：021-51693135 / 021-22818476
ECCOBOND S-3869 is a thermosetting, dielectric adhesivedeveloped for GaN chip bonding for high-brightness LEDs. Itfeatures strong heat / UV resistance and can be applied by pintransfer, stamping and dispensing.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Cone & Plate, @ 25 °C mPa∙s (cP):
Speed 10 rpm 4,200
Specific Gravity @ 25oC 1.28
Pot Life @ 25oC, hours 8
Shelf Life @ -40°C, months 3
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Cure Schedule
2 hours @ 160°C
Shrinkage on Cure
Cure Shrinkage, % 2.1
The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based oncustomers' experience and their application requirements, aswell as customer curing equipment, oven loading and actualoven temperatures. Storage Store product in the unopened container in a dry location.Storage information may be indicated on the product containerlabeling.Optimal Storage: -40 °C
ECCOBOND S-3869是一種熱固性介電膠粘劑開發用于高亮度LED的GaN芯片接合。它具有強熱/抗紫外線性能，可通過針腳施加轉移，沖壓和分配。
固化材料的典型特性
粘度，錐和板，@ 25°C mPa∙s（cP）：
速度10轉4,200
比重@25oC1.28
五十八點零五分鐘
保質期@ -40°C，月3
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