ECCOBOND DX-20C電子組裝/ECCOBOND DX-20C電子組裝/ECCOBOND DX-20C電子組裝/ECCOBOND DX-20C電子組裝/ECCOBOND DX-20C電子組裝/ECCOBOND DX-20C電子組裝/ECCOBOND DX-20C電子組裝/ECCOBOND DX-20C電子組裝/ECCOBOND DX-20C電子組裝/ECCOBOND DX-20C電子組裝/ECCOBOND DX-20C電子組裝/ECCOBOND DX-20C電子組裝/ECCOBOND DX-20C電子組裝/ECCOBOND DX-20C電子組裝/ECCOBOND DX-20C電子組裝/ECCOBOND DX-20C電子組裝/ECCOBOND DX-20C電子組裝/ECCOBOND DX-20C電子組裝/ECCOBOND DX-20C電子組裝/ECCOBOND DX-20C電子組裝/ECCOBOND DX-20C電子組裝/ECCOBOND DX-20C電子組裝/ECCOBOND DX-20C電子組裝/工業膠水/電子組裝膠水/工業用膠
技術服務熱線：021-51693135 / 021-22818476
ECCOBOND DX-20C dielectric adhesive offersexcellent adhesion strength, especially at wirebonding process temperature to minimize defect rateat assembly. It features strong heat / UV resistance andcan be applied by pin transfer, stamping and dispensing.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Cone & Plate, mPa•s (cP):
@ 25°C Speed 10 rpm 12,000
Specific Gravity 1.17
Work Life @ 25°C, days 5
Shelf Life @ -20°C, months 6
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Cure Schedule
1 hour @ 170°C
Time shown does not include ramp-up time to cure temperaure.
The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary
based on customers' experience and their applicationrequirements, as well as customer curing equipment,
oven loading and actual oven temperatures.
Storage Store product in the unopened container in a drylocation. Storage information may be indicated on the productcontainer labeling.Optimal Storage: -20 °C
ECCOBOND DX-20C電介質粘合劑優異的粘合強度，特別是在線材接合工藝溫度以*小化缺陷率在裝配。它具有強烈的耐熱/耐紫外線性能可以通過銷轉印，沖壓和分配來應用。
固化材料的典型特性
粘度，圓錐和平板，mPa•s（cP）：
@ 25°C速度10 rpm 12,000
比重1.17
工作生活@ 25°C，第5天
保質期@ -20°C，月6
閃點 - 參見MSDS
典型的固化性能
治愈時間表
1小時@ 170°C
顯示的時間不包括加溫時間來治愈溫度。
以上治療方案是指導性建議。治愈條件（時間和溫度）可能會有 |
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