ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/工業膠水/電子組裝膠水/工業用膠
技術服務熱線：021-51693135 / 021-22818476
ECCOBOND DX-10C is a thermosetting, dielectricadhesive developed for GaN blue and white LED chip bonding. It features strong heat / UV resistance and can be applied bypin transfer, stamping and dispensing.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity @ 25 °C, mPa∙s (cP):
Speed 10 rpm 3,000
Work Life, hours 4
Shelf Life @ -20°C, months 6
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Cure Schedule
1 hour @ 140°C
Time shown does not include ramp-up time to cure temperaure.The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based oncustomers' experience and their application requirements, aswell as customer curing equipment, oven loading and actualoven temperatures.
Storage Store product in the unopened container in a dry location.Storage information may be indicated on the product containerlabeling.Optimal Storage: -20 °C
ECCOBOND DX-10C是一種熱固性電介質粘合劑開發用于GaN藍色和白色LED芯片接合。它具有強的耐熱/耐紫外線性，可以應用針轉印，沖壓和分配。
固化材料的典型特性
25℃下的粘度，mPa•s（cP）：
速度10 rpm 3,000
工作時間4小時
保質期@ -20°C，月6
閃點 - 參見MSDS
典型的固化性能
治愈時間表
1小時@ 140°C
顯示的時間不包括加溫時間來治愈溫度。以上治療方案是指導性建議。治愈條件（時間和溫度）可能會有所不同客戶的經驗和應用要求以及客戶固化設備，烤箱裝載和實際烘箱溫度。
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