ECCOBOND CE3535電子組裝/工業膠水/電子組裝膠水/工業用膠
技術服務熱線:021-51693135 / 021-22818476
ECCOBOND CE3535 adhesive is a lead-free alternative tosolder. It withstands thermoshock testing with 100% tin finshedcomponents. ECCOBOND CE3535 can be used inapplications with small size components where no bleed orwicking is tolerated.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity at 25°C, mPa•s (cP)
(Plate 2 cm at 15 s
-1 )
40,000 to
60,000
Thixotropic Index 4
Pot Life @ 18 to 25oC, days 2
Work Life:
@ 18 to 25°C (printing), hours 6
Shelf Life @ -40°C, months 4
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Cure Schedule
60 minutes @ 150°C or
10 minutes @ 175°C
The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based oncustomers' experience and their application requirements, aswell as customer curing equipment, oven loading and actualoven temperatures. Storage Store product in the unopened container in a dry location.Storage information may be indicated on the product containerlabeling.
Optimal Storage: -40°C. Storage greater than or below -40°C can adversely affect product properties. ECCOBOND CE3535膠粘劑是無鉛的替代品焊接。它可以用100%的錫板進行熱休克測試組件。 ECCOBOND CE3535可以使用應用小尺寸組件,沒有出血或芯吸容忍。
固化材料的典型特性
25℃下的粘度,mPa•s(cP)
(板15厘米2厘米
-1)
40,000到
60,000
觸變指數4
罐裝壽命@ 18至25oC,第2天
工作生活:
@ 18〜25℃(印刷),小時6
保質期@ -40°C,月4
閃點 - 參見MSDS
典型的固化性能
治愈時間表
在150°C或60分鐘
175°C 10分鐘
以上治療方案是指導性建議。治愈條件(時間和溫度)可能會有所不同客戶的經驗和應用要求以及客戶固化設備,烤箱裝載和實際烘箱溫度。
存儲 將產品存放在未開封的容器中,干燥處。存儲信息可能會在產品容器上顯示標簽。*佳存儲溫度:-40°C。存儲大于或低于-40°C會對產品性能產生不利影響。 |
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