ECCOBOND CE3126電子組裝/ECCOBOND CE3126電子組裝/ECCOBOND CE3126電子組裝/ECCOBOND CE3126電子組裝/ECCOBOND CE3126電子組裝/ECCOBOND CE3126電子組裝/ECCOBOND CE3126電子組裝/ECCOBOND CE3126電子組裝/ECCOBOND CE3126電子組裝/ECCOBOND CE3126電子組裝/ECCOBOND CE3126電子組裝/ECCOBOND CE3126電子組裝/ECCOBOND CE3126電子組裝/ECCOBOND CE3126電子組裝/ECCOBOND CE3126電子組裝/ECCOBOND CE3126電子組裝/ECCOBOND CE3126電子組裝/ECCOBOND CE3126電子組裝/ECCOBOND CE3126電子組裝/ECCOBOND CE3126電子組裝/ECCOBOND CE3126電子組裝/ECCOBOND CE3126電子組裝/ECCOBOND CE3126電子組裝/ECCOBOND CE3126電子組裝/ECCOBOND CE3126電子組裝/ECCOBOND CE3126電子組裝/ECCOBOND CE3126電子組裝/ECCOBOND CE3126電子組裝/ECCOBOND CE3126電子組裝/ECCOBOND CE3126電子組裝/工業膠水/電子組裝膠水/工業用膠
技術服務熱線：021-51693135 / 021-22818476
CE-3126 snap curable anisotropic adhesive is especially suitedin applications where throughput is critical. This product istypically used for very fine pitch flip chip interconnectionswhere electrical conductivity is desired in only one direction.
This material can be spot cured at temperatures as low as 170°C, making it ideal for use with temperature sensitivesubstrates and components.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity at 15 S-1
Rheometer
16,300
Work Life, days 2
Shelf Life @ -40°C, months 6
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Cure Schedule
8 seconds @ 170°C
The recommended cure conditions for CE-3126 depend on thebondline temperature used. When the bondline temperature israised to 170°C, 8 seconds are sufficient to cure theadhesive. The pressure needed during cure is strongly relatedto the exact deisgn set-up. The optimum pressure is bestdetermined for each new design.
Storage Store product in the unopened container in a dry location.Storage information may be indicated on the product containerlabeling.Optimal Storage: -40 °C
CE-3126可固化各向異性粘合劑特別適合在吞吐量至關重要的應用中。這個產品是通常用于非常細的間距倒裝芯片互連其中僅在一個方向上需要導電性。該材料可以在低至170℃的溫度下點固化°C，使其成為溫度敏感的理想選擇基板和部件。
固化材料的典型特性
粘度在15 S-1
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