ECCOBOND CE3104WXL電子組裝/工業(yè)膠水/電子組裝膠水/工業(yè)用膠
技術(shù)服務(wù)熱線:021-51693135 / 021-22818476
樂(lè)泰 ABLESTIK CE 3104WXL is an electrically conductiveepoxy adhesive that is a Pb-free alternative to solder. Thisproduct uses a unique blend of fillers with tightly controlledparticle sizes to provide ultra-fine pitch resolution (<500μm)when printed using either a stainless steel mesh screen or ametal mask stencil. The lower surface tension versus soldermeans no bridging on fine-pitch assembly patterns.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Thixotropic Index 6.0
Viscosity at 25°C, mPa•s (cP)
(Plate 2 cm at 15 s
-1 )
65,000
Work Life @ 25°C, days 3
Shelf Life @ -40°C, days 365
Flash Point - See SDS
TYPICAL CURING PERFORMANCE
Cure Schedule
Reflow:
3 minutes @ 150°C or
5 minutes @ 125°C
Convection:
8 minutes @ 125°C or
5 minutes @ 150°C
The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based oncustomers' experience and their application requirements, aswell as customer curing equipment, oven loading and actualoven temperatures. Storage Store product in the unopened container in a dry location.Storage information may be indicated on the product containerlabeling.
Optimal Storage: -40 to -35°C. Storage below -40°C canadversely affect product properties (freeze-thaw voids).樂(lè)泰 ABLESTIK CE 3104WXL是導(dǎo)電的環(huán)氧樹(shù)脂粘合劑,是無(wú)鉛焊料替代品。這個(gè)產(chǎn)品使用獨(dú)特的填料混合物,具有嚴(yán)格的控制粒徑提供超細(xì)間距分辨率(<500μm)當(dāng)使用不銹鋼篩網(wǎng)或a金屬面膜模具。較低的表面張力對(duì)焊料意味著在細(xì)間距裝配模式上沒(méi)有橋接。
固化材料的典型特性
觸變指數(shù)6.0
25℃下的粘度,mPa•s(cP)
(板15厘米2厘米
-1)
65,000
工作生活@ 25°C,第3天
保質(zhì)期@ -40°C,365天
閃點(diǎn) - 見(jiàn)SDS
典型的固化性能
治愈時(shí)間表
回流:
在150°C或3分鐘
125°C 5分鐘
對(duì)流:
在125°C或8分鐘
150分鐘5分鐘
以上治療方案是指導(dǎo)性建議。治愈條件(時(shí)間和溫度)可能會(huì)有所不同客戶的經(jīng)驗(yàn)和應(yīng)用要求
以及客戶固化設(shè)備,烤箱裝載和實(shí)際烘箱溫度。
存儲(chǔ) 將產(chǎn)品存放在未開(kāi)封的容器中,干燥處。 |
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