ECCOBOND CA3150電子組裝ECCOBOND CA3150電子組ECCOBOND CA3150電子組ECCOBOND CA3150電子組ECCOBOND CA3150電子組ECCOBOND CA3150電子組ECCOBOND CA3150電子組ECCOBOND CA3150電子組ECCOBOND CA3150電子組ECCOBOND CA3150電子組ECCOBOND CA3150電子組ECCOBOND CA3150電子組ECCOBOND CA3150電子組ECCOBOND CA3150電子組ECCOBOND CA3150電子組ECCOBOND CA3150電子組ECCOBOND CA3150電子組ECCOBOND CA3150電子組ECCOBOND CA3150電子組ECCOBOND CA3150電子組ECCOBOND CA3150電子組ECCOBOND CA3150電子組ECCOBOND CA3150電子組ECCOBOND CA3150電子組/工業膠水/電子組裝膠水/工業用膠
技術服務熱線：021-51693135 / 021-22818476
CA3150 adhesive is designed to electrically interconnect diestraps, batteries, and other surface mount components. It issuitable for reel-to-reel production lines and high speed jettingor printing applications and allows exceptional fine pitchresolution. The long work life minimizes product waste andclean-up time, providing increased production efficiency.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity at 15 S-1 , mPa•s (cP)
Rheometer
13,000
Shear Thinning Index (Rheometer) 6
Work Life @ 24°C, days 2
Shelf Life @ -20°C, months 6
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Cure Schedule
10 seconds @ 130°C at bondline
NOTE: CA3150 may be cured using a die bonder or any otherefficient method of rapid heat transfer. No pressure is required duringcure. No post cure required when curing in a convection oven.
The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based oncustomers' experience and their application requirements, aswell as customer curing equipment,oven loading and actualoven temperatures. Storage Store product in the unopened container in a dry location.Storage information may be indicated on the product containerlabeling.Optimal Storage: -20 °C
CA3150粘合劑設計用于電連接裸片帶子，電池和其他表面貼裝元件。它是適用于卷軸到卷軸生產線和高速噴射或打印應用程序，并允許特殊的細微間距解析度。長期的工作壽命*大限度地減少產品浪費清理時間，提高生產效率。
固化材料的典型特性
粘度為15 S-1，mPa•s（cP）
流變儀
13,000
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