ECCOBOND A401電子組裝ECCOBOND A401電子組裝//ECCOBOND A401電子組裝/ECCOBOND A401電子組裝/ECCOBOND A401電子組裝/ECCOBOND A401電子組裝/ECCOBOND A401電子組裝/ECCOBOND A401電子組裝/ECCOBOND A401電子組裝/ECCOBOND A401電子組裝/ECCOBOND A401電子組裝/ECCOBOND A401電子組裝/ECCOBOND A401電子組裝/ECCOBOND A401電子組裝/ECCOBOND A401電子組裝/ECCOBOND A401電子組裝/ECCOBOND A401電子組裝/ECCOBOND A401電子組裝/ECCOBOND A401電子組裝/ECCOBOND A401電子組裝/ECCOBOND A401電子組裝/ECCOBOND A401電子組裝/ECCOBOND A401電子組裝/ECCOBOND A401電子組裝/ECCOBOND A401電子組裝/ECCOBOND A401電子組裝/ECCOBOND A401電子組裝/工業(yè)膠水/電子組裝膠水/工業(yè)用膠
技術(shù)服務(wù)熱線：021-51693135 / 021-22818476
ECCOBOND A401 is a rigid thermally conductive adhesive
recommended for the assembly of components that require
thermal management. It contains aluminum oxide filler and is a
Class F (155°C) insulator with 100% solids.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Brookfield , mPa•s (cP) 85,000
Specific Gravity 1.65 to 1.75
Shelf Life:
@ 40oC, weeks 2
@ 25oC, months 2
@ 0oC, months 6
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Cure Schedule
60 minutes @ 120°C or
30 minutes @ 140°C or
15 minutes @ 160°C or
5 minutes @ 180°C
NOTE: No adverse exotherm effects when cured at 100°C in masses
up to about 200 grams.
The above cure profiles are guideline recommendations. Cure
conditions (time and temperature) may vary based on
customers' experience and their application requirements, as
well as customer curing equipment, oven loading and actual
oven temperatures
product.
Storage
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
labeling.
Optimal Storage: 0 °C
ECCOBOND A401是一種剛性導(dǎo)熱膠
推薦用于組裝需要的組件
熱管理。它含有氧化鋁填料，是一種
F（155°C）絕緣子，100％固體。
固化材料的典型特性
粘度，布魯克菲爾德，mPa•s（cP）85,000
比重1.65〜1.75
保質(zhì)期：
@40oC，周2
@25oC，月2
@0oC，月6
閃點(diǎn) - 參見MSDS
典型的固化 |
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