ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/工業膠水/電子組裝膠水/工業用膠
技術服務熱線：021-51693135 / 021-22818476
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity @ 25 °C, mPa∙s (cP) 20,000
Shelf Life:
@ 0 to 8oC, months 4
@ 18 to 25oC, months 3 Density, ASTM-D-792, g/cc 1.1
ECCOBOND A164-1 provides the following product characteristics:
Technology Epoxy
Appearance Tan
Cure Heat cure
Product Benefits • Non-conductive
• Good adhesion
• Good peel strength
• Excellent thermal shock resistance
• One component
Application Automotive Electronics Substrates Metals, Glass and Plastics
The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary based on customers' experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.
固化材料的典型特性
粘度@ 25℃，mPa•s（cP）20,000
保質期：
@ 0至8oC，月4
@ 18至25oC，月3密度，ASTM-D-792，g / cc 1.1
ECCOBOND A164-1提供以下產品特性：
技術環氧樹脂
外觀譚
治療熱固化
產品優點•不導電
•附著力好
•良好的剝離強度
•優異的耐熱沖擊性
•一個組件
應用汽車電子基材金屬，玻璃和塑料以上治療方案是指導性建議。固化條件（時間和溫度）可能會根據客戶 |
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