ECCOBOND 57C電子組裝/ECCOBOND 57C電子組裝/ECCOBOND 57C電子組裝/ECCOBOND 57C電子組裝/ECCOBOND 57C電子組裝/ECCOBOND 57C電子組裝/ECCOBOND 57C電子組裝/ECCOBOND 57C電子組裝/ECCOBOND 57C電子組裝/ECCOBOND 57C電子組裝/ECCOBOND 57C電子組裝/ECCOBOND 57C電子組裝/ECCOBOND 57C電子組裝/ECCOBOND 57C電子組裝/ECCOBOND 57C電子組裝/ECCOBOND 57C電子組裝/ECCOBOND 57C電子組裝/ECCOBOND 57C電子組裝/ECCOBOND 57C電子組裝/ECCOBOND 57C電子組裝/ECCOBOND 57C電子組裝/ECCOBOND 57C電子組裝/ECCOBOND 57C電子組裝/ECCOBOND 57C電子組裝/ECCOBOND 57C電子組裝/ECCOBOND 57C電子組裝/ECCOBOND 57C電子組裝/ECCOBOND 57C電子組裝/ECCOBOND 57C電子組裝/ECCOBOND 57C電子組裝/ECCOBOND 57C電子組裝/ECCOBOND 57C電子組裝/ECCOBOND 57C電子組裝/ECCOBOND 57C電子組裝/ECCOBOND 57C電子組裝/工業膠水/電子組裝膠水/工業用膠
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樂泰 ABLESTIK 57C adhesive is designed to make electricalconnections where hot soldering is impractical and room temperaturecure is required.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Part A Properties Part A
Density , g/cm3 3.5
Shelf Life @ 25°C (from date of manufacture), days 120
Flash Point - See SDS
Part B Properties Part B
Density , g/cm3 3.1
Shelf Life @ 25°C (from date of manufacture), days 120
Flash Point - See SDS
Mixed Properties
Density , g/cm3 3.5
Working Time, 100 g mass, @ 25 °C, minutes 60
TYPICAL CURING PERFORMANCE
Cure Schedule
16 to 24 hours @ 25°C
3 hours @ 65°C
45 minutes @ 100°C
The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based on customers'experience and their application requirements, as well as customercuring equipment, oven loading and actual oven temperatures
Storage
Store in original, tightly covered containers in clean, dry areas.Storage information may be indicated on the product containerlabeling.Optimal Storage : 25 °C 樂泰 ABLESTIK 57C粘合劑設計用于制造電氣熱焊接不切實際和室溫的連接治愈是必需的。
固化材料的典型特性
A部分屬性A部分
密度，g / cm 3 3.5
保質期@ 25°C（從制造日期），第120天
閃點 - 見SDS
B部分屬性B部分
密度，g / cm 3 3.1
保質期 |
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