ECCOBOND 282電子組裝/ECCOBOND 282電子組裝/ECCOBOND 282電子組裝/ECCOBOND 282電子組裝/ECCOBOND 282電子組裝/ECCOBOND 282電子組裝/ECCOBOND 282電子組裝/ECCOBOND 282電子組裝/ECCOBOND 282電子組裝/ECCOBOND 282電子組裝/ECCOBOND 282電子組裝/ECCOBOND 282電子組裝/ECCOBOND 282電子組裝/ECCOBOND 282電子組裝/ECCOBOND 282電子組裝/ECCOBOND 282電子組裝/ECCOBOND 282電子組裝/ECCOBOND 282電子組裝/工業膠水/電子組裝膠水/工業用膠
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ECCOBOND 282 is recommended for bonding metals and ceramics in conjunction with high temperature generating components such as semiconductor devices. It is a good choice for high speed production lines.
The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary based on customers' experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.
Storage
Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling.
Optimal Storage: 0 to 8°C. Storage greater than or below 0 to 8°C can adversely affect product properties.
推薦使用ECCOBOND 282將金屬和陶瓷與諸如半導體器件的高溫發生元件結合使用。它是高速生產線的不錯選擇。
以上治療方案是指導性建議。固化條件(時間和溫度)可能會根據客戶的經驗和應用要求以及客戶固化設備,烤箱裝載量和實際烤箱溫度而有所不同。
存儲
將產品存放在未開封的容器中,干燥處。存儲信息可能在產品容器標簽上顯示。
*佳儲存:0至8°C。超過或低于0至8°C的儲存可能會對產品性能產生不利影響。 |
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