ECCOBOND 2332電子組裝/工業膠水/電子組裝膠水/工業用膠
技術服務熱線：021-51693135 / 021-22818476
ECCOBOND 2332 is a solventless epoxy adhesive that develops high bond strength when cured at temperatures as low as 100°C. This product combines toughness at low temperatures plus high peel and tensile shear strengths over a very broad temperature range.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity @ 25 °C, mPa∙s (cP) 65,000 to
85,000
Specific Gravity 1.17 to
1.23
Shelf Life @ 0 to 8°C, months 6
The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary based on customers' experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.
Storage
Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling.
Optimal Storage: 0 to 8°C. Storage greater than or below 0 to 8°C can adversely affect product properties.
ECCOBOND 2332是一種無溶劑環氧樹脂粘合劑，在低至100℃的溫度下固化時，會發生高粘結強度。該產品在非常寬的溫度范圍內結合了低溫韌性和高剝離強度和拉伸剪切強度。
固化材料的典型特性
粘度@ 25°C，mPa∙s（cP）65,000至
85,000
比重1.17到
1.23
保質期0至8°C，月6
以上治療方案是指導性建議。固化條件（時間和溫度）可能會根據客戶的經驗和應用要求以及客戶固化設備，烤箱裝載量和實際烤箱溫度而有所不同。
存儲
將產品存放在未開封的容器中，干燥處。存儲信息可能在產品容器標簽上顯示。
*佳儲存：0至8°C。超過或低于0至8°C的儲存可能會對產品性能產生不利影響。 |
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