STYCAST E1070電子組裝/STYCAST E1070電子組裝/STYCAST E1070電子組裝/STYCAST E1070電子組裝/STYCAST E1070電子組裝/STYCAST E1070電子組裝/STYCAST E1070電子組裝/STYCAST E1070電子組裝/STYCAST E1070電子組裝/STYCAST E1070電子組裝/STYCAST E1070電子組裝/STYCAST E1070電子組裝/STYCAST E1070電子組裝/STYCAST E1070電子組裝/STYCAST E1070電子組裝/STYCAST E1070電子組裝/STYCAST E1070電子組裝/STYCAST E1070電子組裝/STYCAST E1070電子組裝/STYCAST E1070電子組裝/STYCAST E1070電子組裝/STYCAST E1070電子組裝/STYCAST E1070電子組裝/STYCAST E1070電子組裝/STYCAST E1070電子組裝/STYCAST E1070電子組裝/STYCAST E1070電子組裝/工業膠水/電子組裝膠水/工業用膠
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STYCAST E1070 epoxy encapsulant is recommended for small mass potting applications, <50 grams.
TYPICAL PROPERTIES OF UNCURED MATERIAL Viscosity, Brookfield , mPa•s (cP) 3,000Density, g/cm3 1.14 Shelf Life @ 25°C (from date of manufacture), months 4 TYPICAL CURING PERFORMANCE Cure Schedule30 minutes @ 100°C 15 minutes @ 120°C 3 minutes @ 160°CFor optimum performance, follow the initial cure with a post cure of 2 to 4 hours at the highest expected use temperature.
This product generates moderate heat during cure. No adverse exotherm effects are obtained when cured at 160oC in masses up to approximately 40 grams.
The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary based on customers' experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.
Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling.Optimal Storage : 25 °C
推薦使用STYCAST E1070環氧密封劑,小批量灌封應用<50克。
固化材料的典型性質粘度,布氏粘度,mPa•s(cP)3,000密度,g /cm31.14 25°C保質期(自生產日期),月4典型固化性能固化時間30分鐘@ 100°C 15分鐘@ 120°C 3分鐘,160°F,*佳性能,在*高預期使用溫度下進行固化2至4小時后進行初始固化。
該產品在治療過程中產生適度的熱量。在160℃下固化,質量高達約40克時,不會產生不利的放熱效應。
以上治療方案是指導性建議。固化條件(時間和溫度)可能會 |
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