樂泰 5404電子組裝/樂泰 5404電子組裝/樂泰 5404電子組裝/樂泰 5404電子組裝/樂泰 5404電子組裝/樂泰 5404電子組裝/樂泰 5404電子組裝/樂泰 5404電子組裝/樂泰 5404電子組裝/樂泰 5404電子組裝/樂泰 5404電子組裝/樂泰 5404電子組裝/樂泰 5404電子組裝/樂泰 5404電子組裝/樂泰 5404電子組裝/樂泰 5404電子組裝/樂泰 5404電子組裝/樂泰 5404電子組裝/樂泰 5404電子組裝/樂泰 5404電子組裝/樂泰 5404電子組裝/樂泰 5404電子組裝/樂泰 5404電子組裝/樂泰 5404電子組裝/樂泰 5404電子組裝/樂泰 5404電子組裝/樂泰 5404電子組裝/樂泰 5404電子組裝/樂泰 5404電子組裝/樂泰 5404電子組裝/樂泰 5404電子組裝/樂泰 5404電子組裝/樂泰 5404電子組裝/樂泰 5404電子組裝/工業膠水/電子組裝膠水/工業用膠
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SI 5404™ is designed to bond metallic heat sinks, ceramicchips and circuit board substrates.
SI 5404™ applicationsinclude the bonding of various heat generating devices (powerdevices) to their respective heat sinks.
The adhesive isdesigned to provide a strong bond between the device and itsheat sink as well as low resistance to the flow of heat from theelectronic device to the heat sink.
This will help maintain aconsistent dispersion of the conductive filler within the adhesivematrix.Suggested minimum heat cure conditions for either IR or convectionoven: 10 minutes at 150°C or 15 minutes at 130°C.
All times givenabove are exclusive of heat up rate. It is essential that the bond linesattain these temperatures for the stated times.
Cure rate is verydependent on the oven type used, the size and geometry of the partsbeing bonded as well as their composition.
StorageStore product in the unopened container in a dry location.
Storage information may be indicated on the product containerlabeling.Optimal Storage: 2 °C to 8 °C.
Storage below 2 °C orgreater than 8 °C can adversely affect product properties.
SI 5404™設計用于粘接金屬散熱器，陶瓷芯片和電路板基板。
SI 5404™應用包括將各種發熱設備（電力設備）連接到各自的散熱器。
粘合劑被設計成在裝置和其熱槽之間提供牢固的結合，以及對從電子 |
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