HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/工業膠水/電子組裝膠水/工業用膠
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HYSOL®US2350™ is a flexible, flame retardant, mineral filled, polyurethane compound. This potting compound has long pot life, and is low viscosity so it flows well and adheres to many substrates.
It has very low odor and does not contain TDI or mercury compounds. TYPICAL PROPERTIES OF UNCURED MATERIAL Part A Properties.
Density, @ 23 °C, g/cm3 1.24Viscosity, Brookfield - RVF, cP:Spindle 2, speed 20 rpm 55Part B Properties.
Density, @ 23 °C, g/cm3 1.46Viscosity, Brookfield - RVF, cP:Spindle 5, speed 20 rpm 13,000Mixed Properties
Working Time, 300 gm mass @ 23 °C, minutes 45Gel Time, 300 gm mass @ 23 °C, minutes 90Techne Gel, 140 gm mass, minutes 103Viscosity, Brookfield - RVF, 23 °C, mPa•s (cP):Spindle 2, speed 20 rpm 2,400TYPICAL CURING PERFORMANCE Recommended Curing Conditions12 to 24 hours @ 23 °C (Recommended cure)1 to 3 hours @ 23 °C (Alternate cure)
Storage Store product in the unopened container in a dry location. Storage information may be indicated on the product containerlabeling.
Liquid Storage - Liquids should be stored at 23°C or below, in closed containers. If stored below 23°C, the material MUST be allowed to come to room temperature, in the sealed container, to avoid moisture contamination.
HYSOL®US2350™是一種柔性，阻燃，礦物填充的聚氨酯化合物。
這種灌封膠具有較長的固化時間，粘度低，因此流動良好，并粘附于載體 |
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