HYSOL ES1301電子組裝/HYSOL ES1301電子組裝/HYSOL ES1301電子組裝/HYSOL ES1301電子組裝/HYSOL ES1301電子組裝/HYSOL ES1301電子組裝/HYSOL ES1301電子組裝/HYSOL ES1301電子組裝/HYSOL ES1301電子組裝/HYSOL ES1301電子組裝/HYSOL ES1301電子組裝/HYSOL ES1301電子組裝/HYSOL ES1301電子組裝/HYSOL ES1301電子組裝/HYSOL ES1301電子組裝/HYSOL ES1301電子組裝/HYSOL ES1301電子組裝/HYSOL ES1301電子組裝/HYSOL ES1301電子組裝/工業膠水/電子組裝膠水/工業用膠
技術服務熱線：021-51693135 / 021-22818476
HYSOL®ES1301™ is a silica filled epoxy casting system recommended for coils, transformers, and general puposecasting.
TYPICAL PROPERTIES OF UNCURED MATERIAL Part A Properties Filler Content, % 50Viscosity, Brookfield -, 25 °C, cP:Spindle 5, speed 20 rpm 10,500Density, @ 25 °C, g/cm3 1.6Part B Properties Filler Content, % 0Viscosity, Brookfield - RVF, 25 °C, cP:Spindle 5, speed 20 rpm 750Density, @ 25 °C, g/cm3 1.19Mixed Properties Viscosity, Brookfield - RVF, 25 °C, cP:Spindle 3, speed 20 rpm 1,600Gel Time, 200gm mass @ 25 °C, hours >8TYPICAL CURING PERFORMANCE Recommended Curing Conditions4 hours @ 110 °C (Recommended cure)2 hours @ 125 °C (Alternate cure)
TYPICAL PROPERTIES OF CURED MATERIAL Physical Properties:Glass Transition Temperature (Tag), °C 112Coefficient of Linear Thermal Expansion, ppm/oC:Alpha 1, Above Tag @ 130 to 150 °C 169Alpha 2, Below Tag @ 40 to 60 °C 67Thermal Conductivity, W/mk 0.42Density, , g/cm3 1.44Linear Shrinkage, % 0.84Shore Hardness , Udometer D 90 to 95Tensile Strength, psi 6,953Flexural Strength, psi 15,786
Tensile Elongation, % 1.0StorageStore product in the unopened container in a dry location. Storage information may be indicated on the product containerlabeling.
Optimal Storage: 20 °C to 30 °C. Storage below 20 °Co greater than 30 °C can adversely affect product properties.
HYSOL®ES1301™是一種二氧化硅填充型環氧樹脂澆注系統，建議用于線圈，變壓器和普通的微孔。
固化材料的特性特性填料含量％50粘度，
布魯克菲爾德，25℃，cap：主軸5，速度20rpm 10,500密度， @ 25℃，g / cm 3 1.6Part B性能填料含量％Viscosity，Brookfield-RVF，25℃，cap：主軸5，速度20rpm 750密度，@ 25℃，g / |
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