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EO1086 epoxy encapsulate is designed for use in applications requiring excellent handling properties. The cured material survives severe thermal shock and offers continuous service to177 °C.
TYPICAL PROPERTIES OF UNCURED MATERIALViscosity, Brookfield , 25 °C, mPa•s (cap):Spindle 7, speed 10 rpm 62,500Specific Gravity @ 25 °C 1.58
Filler Content, % 50Gel Time @ 121oC, minutes 8.1Pot Life @ 25oC, days 7Shelf Life @ 4°C, months 6Flash Point - See MSDSTYPICAL CURING PERFORMANCE Recommended Cure Schedule30 minutes @ 120°CAlternative Cure Schedule20 minutes @ 130°C15 minutes @ 150°CThe above cure schedules represent actual bond line/material temperatures.
The above cure profile is a guideline recommendation. Cure conditions (time and temperature) may vary based noncustomers’' experience and their application requirements, swell as customer curing equipment, oven loading and actual oven temperatures.
TYPICAL PROPERTIES OF CURED MATERIAL Physical Properties: Coefficient of Thermal Expansion :Below Tag, pap/°C 43Above Tag, pap/°C 135Glass Transition Temperature (Tag) by TMA, °C 137StorageStore product in the unopened container in a dry location.
Storage information may be indicated on the product containerlabeling.Optimal Storage: 2 to 8 °C. Storage greater than 8 °C can adversely affect product properties.
EO1086環(huán)氧密封劑設(shè)計(jì)用于需要優(yōu)異處理性能的應(yīng)用。固化的材料會(huì)嚴(yán)重的發(fā)生熱沖擊,并提供連續(xù)使用溫度至177°C。
固化材料的性能特性粘度,布魯克菲爾德,25°C,map’s(cap):主軸7,轉(zhuǎn)速10 rpm 62,500特定重力@ 25°C 1.58填充內(nèi)容,%50Gel時(shí)間@121oC,分鐘8.1Pot壽命@25oC,天7Shelf壽命@ 4°C,6個(gè)閃點(diǎn) - 見(jiàn)MSDSTYPICAL CURING PERFORMANCER推薦治療計(jì)劃30分鐘@ 120°CA替代治療時(shí)間表20分鐘@ 130°C 15分鐘@ 150°上 |
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