ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/工業膠水/電子組裝膠水/工業用膠
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ECCOBOND TE3530 adhesive is designed for bonding heat dissipation components and can be applied by automatic syringe dispense.
TYPICAL PROPERTIES OF UNCURED MATERIALViscosity @ 25 °C, mPa∙s (cap):@ 10 s-1 60,000Specific Gravity 2.6 to 2.85Hegman Fineness, micron 40Shelf Life:@ -25 to -18oC, months 6@ 18 to 25oC, days 3Flash Point - See MSDSTYPICAL CURING PERFORMANCE Cure Schedule30 minutes @ 100°C or15 minutes @ 120°C or10 minutes @ 150°CNOTE: Cure can be accelerated by using IR cure instead of convection oven curette above cure profiles are guideline recommendations.
Cure conditions (time and temperature) may vary based noncustomers’' experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.
TYPICAL PROPERTIES OF CURED MATERIAL Physical Properties: Coefficient of Thermal Expansion , K-1 36×10-6Glass Transition Temperature (Tag) ,DMA, °C55Thermal Conductivity, W/mk 2.3StorageStore product in the unopened container in a dry location.
Storage information may be indicated on the product containerlabeling.Optimal Storage: -25 to -18 °C.
ECCOBOND TE3530粘合劑設計用于粘合散熱部件，可通過自動注射器分配應用。
25℃，mPa∙s（cap）下的固化材料的特性：@ 10 s-1 60,000特殊重力2.6至2.85Hegman細度，微米40Shelf壽命：@ -25至-18oC，月6日18至25oC，第3天閃點 - 參見MSDSTYPICAL CURING PERFORMANCECURE Schedule在100°C或30分鐘，在120°C或15分鐘，150°C或10分鐘@ 150°CNOTE：可以通過使用紅外固化加快固化，而不是對流固化上述固化曲線是指導性建議。保養條件（時間和溫度）可能會根據客戶的經驗和應用要求以及客 |
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