ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/ECCOBOND G909電子組裝/工業膠水/電子組裝膠水/工業用膠
技術服務熱線：021-51693135 / 021-22818476
ECCOBOND G909 is designed for very high strength structural bonding especially for dissimilar substrates that will be exposed to a wide range of operating temperatures.
TYPICAL PROPERTIES OF UNCURED MATERIAL Specific Gravity 1.15Press Flow, seconds 65Sag Resistance, mm 12.7Shelf Life @ 0 to 4°C (from date of manufacture), months 4.5Flash Point - See MSDSTYPICAL CURING PERFORMANCE Cure Schedule90 minutes @ 100°C or30 minutes @ 120°C or20 minutes @ 150°CPost Cure2 to 4 hours at the highest expected use temperature Cure schedules are "the time at cure temperature to achieve full product cure".
The times does not include the time required tramp-up to cure temperature.
The above cure profiles are guideline recommendations.
Cure conditions (time and temperature) may vary based on customers’ experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.
TYPICAL PROPERTIES OF CURED MATERIAL Physical Properties: Hardness Shore D:@ 25oC 78@ 120oC 35Storage.
Store product in the unopened container in a dry location.
Storage information may be indicated on the product containerlabeling.
Optimal Storage: 4°C.
Storage greater than or below 4°Ccan adversely affect product properties.
ECCOBOND G909設計用于非常高強度的結構粘合，特別適用于將暴露于寬范圍工作溫度的不同基材。
特殊材料的特性特殊重力1.15壓力流量，秒65抗張力，mm 12.7Shelf壽命（0至4°C制造日期），月份4.5閃點 - 參見MSDSTYPICAL CURING PERFORMANCECURE Schedule 120分鐘，100°C或30分鐘，120°C或20分鐘，150°CPost固化2至4小時，*高預期使用溫度固化時間表為 |
 |
|
手機站
您當前位置是：產品大全 >> 化工 >>
膠粘劑
免責聲明：以上所展示的信息由會員自行提供，內容的真實性、準確性和合法性由發布會員負責，www.qy6.com對此不承擔任何責任。如有侵犯您的權益，請來信通知刪除。
10
聯系信息
