ECCOBOND G757HF電子組裝/ECCOBOND G757HF電子組裝/ECCOBOND G757HF電子組裝/ECCOBOND G757HF電子組裝/ECCOBOND G757HF電子組裝/ECCOBOND G757HF電子組裝/ECCOBOND G757HF電子組裝/ECCOBOND G757HF電子組裝/ECCOBOND G757HF電子組裝/ECCOBOND G757HF電子組裝/ECCOBOND G757HF電子組裝/ECCOBOND G757HF電子組裝/ECCOBOND G757HF電子組裝/ECCOBOND G757HF電子組裝/ECCOBOND G757HF電子組裝/ECCOBOND G757HF電子組裝/工業(yè)膠水/電子組裝膠水/工業(yè)用膠
技術(shù)服務(wù)熱線：021-51693135 / 021-22818476
ECCOBOND G757HF photo curable adhesive is designed for high throughput assembly operations.
TYPICAL PROPERTIES OF UNCURED MATERIAL Density , g/cm3 1.15Sag Resistance (45o angle), mm:@ 25oC 1.88@ 150oC 3.1Shelf Life @ 0°C, months 6Flash Point - See MSDSTYPICAL CURING PERFORMANCE Cure Schedule45 minutes @ 140°C20 minutes @ 160°C or10 minutes @ 180°C or Post Cure2 to 4 hours at the highest expected use temperature This product generates high heat during cure.
No adverse exothermeffects are obtained when cured in bond thicknesses less than or about 0.125 inches (3.2 mm).
The above cure profiles are guideline recommendations.
Cure conditions (time and temperature) may vary based on customers’ experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.
TYPICAL PROPERTIES OF CURED MATERIAL Physical Properties: Hardness, :Shore D @ 25oC 44Shore A @ 120oC 35.
Storage Store product in the unopened container in a dry location.
Storage information may be indicated on the product containerlabeling.
Optimal Storage: 0°C.
Storage greater than or below 0°Ccan adversely affect product properties.
ECCOBOND G757HF可光固化粘合劑專門設(shè)計用于高輸出組裝操作。
固化材料的特性密度，g /cm31.15抗鋸齒性（45o角），mm：@25oC1.88@150oC3.1Shelf壽命@ 0°C，6個閃點 - 參見MSDSTYPICAL CURING PERFORMANCECURE Schedule 160分鐘@ 160°C，180°C或180°C 10分鐘或固化2至*高預(yù)期使用溫度下4小時本產(chǎn)品產(chǎn)生高熱量治愈期間當焊接厚度小于或小于0.125英寸（3.2毫米）時，不會產(chǎn)生不利的放熱效應(yīng)。
上述固化曲線是指導(dǎo)性建議。
保養(yǎng)條件（時間和溫度）可能會根據(jù)客戶的經(jīng)驗和應(yīng)用要求，以及定制設(shè)備，烤箱裝載和實際烤箱溫度而有所不同。
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