ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/工業(yè)膠水/電子組裝膠水/工業(yè)用膠
技術(shù)服務(wù)熱線：021-51693135 / 021-22818476
樂泰 ABLESTIK G 500HF is a general purpose epoxy adhesive and sealant that cures to a high gloss finish.
TYPICAL PROPERTIES OF UNCURED MATERIAL Density, g/cm3 1.45Sag Resistance, mils 600 to 900 Press Flow, seconds 30 to 60Shelf Life @ 25°C, months 3Flash Point - See SDSTYPICAL CURING PERFORMANCE Cure Schedule60 minutes @ 125°C or20 minutes @ 150°C or5 minutes @ 175°C For optimum performance, follow the initial cure with a post cure of 2 to4 hours at the highest expected use temperature.
The above cure profiles are guideline recommendations.
Cure conditions (time and temperature) may vary based on customers’ experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.
StorageStore product in the unopened container in a dry location.
Storage information may be indicated on the product containerlabeling.Optimal Storage: 25°C.
Storage greater than or below 25°C can adversely affect product properties.
樂泰 ABLESTIK G 500HF是一種通用的環(huán)氧樹脂膠粘劑和密封劑，可以固化成高光澤度。
固化材料的特性密度，g /cm31.45耐壓，密耳600至900按流量，秒30至60秒25°C以下的壽命，3個閃點 - 見125℃或150分鐘或175℃下5分鐘的125℃或20分鐘的靜態(tài)固化性能表為了獲得*佳性能，請在*高預(yù)期使用溫度下進行固化2至4小時的初始固化。
以上治療方案是準(zhǔn)則建議。
保養(yǎng)條件（時間和溫度）可能會根據(jù)客戶的經(jīng)驗和應(yīng)用要求以及定制設(shè)備，烤箱裝載和實際烤箱溫度而有所不同。
存儲在未打開的容器中的產(chǎn)品在干燥的位置。
存儲信息可能在產(chǎn)品上顯示容器標(biāo)簽。
*佳儲存：25°C。超過或低于25° |
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