ECCOBOND 282電子組裝/工業膠水/電子組裝膠水/工業用膠
技術服務熱線：021-51693135 / 021-22818476
ECCOBOND 282 is recommended for bonding metals and ceramics in conjunction with high temperature generating components such as semiconductor devices.
It is a good choice for high speed production lines.
TYPICAL CURING PERFORMANCE Cure Schedule4 hours @ 100°C or1 hour @ 125°C or30 minutes @ 150°C or 15 minutes @ 175°CDIRECTIONS FOR USE1.
Complete cleaning of the substrates should be performed to remove contamination such as oil, grease, scale, mold release and loose foreign matter.
Vinyl surfaces should be cleaned by wiping with clean cloth saturated with methyl ethyl ketone.2. Apply adhesive to all surfaces to be bonded and join together.3.
In most applications only contact pressure is required.
Not for product specifications The technical data contained herein are intended as reference only.
Please contact your local quality department for assistance and recommendations on specifications for this product.StorageStore product in the unopened container in a dry location.
Storage information may be indicated on the product container labeling.
Optimal Storage: 0 to 8°C. Storage greater than or below 0 to 8°C can adversely affect product properties.
推薦使用ECCOBOND 282將金屬和陶瓷與諸如半導體器件的高溫發生元件結合使用。對于高速生產線是一個很好的選擇。
特殊固化性能在175°C或100°C或100°C或100°C或150°C或150°C的175°C條件下，在175°C或15分鐘時，可以在100°C或1小時內固化。
應對基材進行完全清潔，以清除污染物，如油，油脂，水垢，脫模和疏松的異物。
乙烯基表面應用用乙基甲基飽和的干凈布擦拭。將粘合劑粘合到要粘合的所有表面上并連接在一起。
在大多數應用中，僅需要接觸壓力。不適用于產品規格本文包含的技術數據僅供參考。請聯系您當地的質量部門以獲取有關本產品規格的幫助和建議。
Storage age Store將產品放在未開封的容器中，干燥處。
存儲信息可能在產品容器標簽上顯示。
*佳存儲：0至8°C。超過或低于0至8°C的儲存可能會對產品性能產生不利影響。 |
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