HYSOL GR750-SC電子膠水/塑封膠水/漢高樂泰膠水/塑封方案
技術(shù)服務(wù)熱線：021-51693135 / 021-22818476
Hysol®GR750-SC™ is an epoxy molding compounddesigned to improve thermal management in semiconductordevices.
TYPICAL PROPERTIES OF UNCURED MATERIALGel Time @ 175 °C, seconds 26Spiral Flow, @ 175°C, cm 45Shelf Life:@ 5oC, months 12Hot Hardness,Shore-d @ 175°C, 90 second 85Flash & bleed, mm:3.0 mil 32.0 mil 11.0 mil 10.5 mil 30.25 mil 2TYPICAL PROCESS DATAHandlingPreheat Temperature 85 to 95Molding Temperature, °C 170 to 190Molding Pressure, Kg/cm2 45 to 85Transfer Time, seconds 12 to 20Curing Time, 3 mm section:@ 170oC, seconds 90 to 120@ 190oC, seconds 75 to 105Post Cure @ 175°C, hours 4 to 6GR750-SC™ has been formulated to provide the best possiblemoldability and as wide a molding latitude as possible.
Although molding and curing conditions will vary from situationto situation, recommended starting ranges are shown above.StorageStore product in the unopened container in a dry location.
Storage information may be indicated on the product containerlabeling.Powder Storage - Powder or preforms should be stored at 5oCor below, in closed containers. After removal from coldstorage, the material MUST be allowed to come to roomtemperature, in the sealed container, to avoid moisturecontamination.
The suggested waiting time for a standard 15kg carton box is 24 hours.
Hysol®GR750-SC™是一種環(huán)氧樹脂模塑料，用于改善半導(dǎo)體器件的熱管理。
固化材料的特性特性時間@ 175°C秒秒螺旋流@ 175°C，45°壽命：@5oC，月12硬度，岸-d @ 175℃，90秒85閃點(diǎn)和放電，mm：3.0密耳32.0密耳11.0密耳10.5密耳30.25密耳2特殊工藝數(shù)據(jù)處理預(yù)熱溫度85至95塑型溫度，℃170至190℃成型壓力Kg / cm 2 45〜85轉(zhuǎn)印時間秒12〜20℃固化時間3mm截面：@170oC，秒90〜120 @190oC，秒75〜105℃固化@ 175℃，小時4〜6GR750-SC™已經(jīng)配制成提供盡可能*好的可塑性和寬的成型緯度。
雖然成型和固化條件將因情況而異對于情況，推薦的起始范圍如上所示。
儲存產(chǎn)品在未開封的容器中，在干燥的位置。
儲存信息可能在產(chǎn)品容器標(biāo)簽上指示。
粉末儲存 - 粉末或預(yù)制件應(yīng)存放在5oC以下，密閉容器中。
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