HYSOL GR750電子膠水/塑封膠水/漢高樂泰膠水/塑封方案HYSOL GR750電子膠水/塑封膠水/漢高樂泰膠水/塑封方案HYSOL GR750電子膠水/塑封膠水/漢高樂泰膠水/塑封方案HYSOL GR750電子膠水/塑封膠水/漢高樂泰膠水/塑封方案HYSOL GR750電子膠水/塑封膠水/漢高樂泰膠水/塑封方案HYSOL GR750電子膠水/塑封膠水/漢高樂泰膠水/塑封方案HYSOL GR750電子膠水/塑封膠水/漢高樂泰膠水/塑封方案HYSOL GR750電子膠水/塑封膠水/漢高樂泰膠水/塑封方案HYSOL GR750電子膠水/塑封膠水/漢高樂泰膠水/塑封方案HYSOL GR750電子膠水/塑封膠水/漢高樂泰膠水/塑封方案HYSOL GR750電子膠水/塑封膠水/漢高樂泰膠水/塑封方案HYSOL GR750電子膠水/塑封膠水/漢高樂泰膠水/塑封方案HYSOL GR750電子膠水/塑封膠水/漢高樂泰膠水/塑封方案HYSOL GR750電子膠水/塑封膠水/漢高樂泰膠水/塑封方案HYSOL GR750電子膠水/塑封膠水/漢高樂泰膠水/塑封方案HYSOL GR750電子膠水/塑封膠水/漢高樂泰膠水/塑封方案HYSOL GR750電子膠水/塑封膠水/漢高樂泰膠水/塑封方案
技術服務熱線：021-51693135 / 021-22818476
Hysol®GR750™ is an epoxy molding compound designed toimprove thermal management in semiconductor devices.GR750™ meets UL 94 V-0 Flammability at 3.175mmthickness.
TYPICAL PROPERTIES OF UNCURED MATERIALGel Time @ 175 °C, seconds 30Spiral Flow, @ 175°C, cm 65Shelf Life:@ 5oC, months 12TYPICAL PROCESS
DATAHandlingPreheat Temperature 85 to 95Molding Temperature, °C 170 to 190Molding Pressure, Kg/cm2 42 to 85Transfer Time, seconds 12 to 20Curing Time, 3 mm section:@ 170oC, seconds 90 to 120
@ 190oC, seconds 75 to 105Post Cure @ 175°C, hours 4 to 6GR750™
has been formulated to provide the best possiblemoldability and as wide a molding latitude as possible.Although molding and curing conditions will vary from situationto situation, recommended starting ranges are shown above.StorageStore product in the unopened container in a dry location.
Storage information may be indicated on the product containerlabeling.Powder Storage - Powder or preforms should be stored at 5oCor below,
in closed containers. After removal from coldstorage, the material MUST be allowed to come to roomtemperature, in the sealed container, to avoid moisturecontamination.
The suggested waiting time for a standard 15kg carton box is 2 |
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