HYSOL KLGR640HV-S4電子膠水/塑封膠水/漢高樂泰膠水/塑封方案
技術服務熱線:021-51693135 / 021-22818476
Product HYSOL GR640HV-S4 DESCRIPTION Low stress is suitable for SOT packages.
Does not contain bromine and antimony or phosphorus flame retardants. With the lowest cost of ownership and excellent formability, stability.
Thermal conductivity 0.8 W / Mk MSL L1 / 260 ° C Linear flow, cm 79 Hot plate gel time, seconds 24 Filling content% 72CTEa1, ppM / ℃ 18 Tg, ℃ 175 Main features Suitable for high pressure applications.
產品HYSOL GR640HV-S4 描述 低應力適用于 SOT 封裝。
不含溴和銻或磷系 阻燃劑。具有*低擁有成本和優良成型性、 穩定性。
導熱率0.8 W/Mk MSL L1/260℃ 線性流 動,厘米 79熱板凝膠 時間,秒24填充含 量 % 72CTEa1, ppM/℃ 18 Tg, ℃ 175
主要特點適合于高壓應用。 |
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