HYSOL KL-G800H電子膠水/塑封膠水/漢高樂泰膠水/塑封方案
技術服務熱線：021-51693135 / 021-22818476
KL-G800H epoxy molding compound is suitable forthin leaded package without any flame retardant..
This materialis designed to achieve JEDEC Level 2 requirements, at 260°Creflow temperature.
KL-G800H meets UL 94 V-0 Flammability at 3.175mm hickness.TYPICAL PROPERTIES OF UNCURED MATERIALGel Time @ 175 °C, seconds 28
Spiral Flow, @ 175°C, cm 115Shelf Life:@ 5oC, months 6TYPICAL PROCESS DATAHandling
Preheat Temperature :Conventional mold, °C 80 to 100Automold, seconds 0 to 5Molding Temperature, °C 150 to 195Molding Pressure, Kg/cm2 40 to 100Transfer Time:
Conventional mold, seconds 10 to 15Automold, seconds 4 to 10Curing Time, @ 175oC, seconds:Conventional mold, 70 to 120Automold, 70 to 90Post Cure @ 175°C, hours 4 to 6
KL-G800H has been formulated to provide the best possiblemoldability and as wide a molding latitude as possible. Althoughmolding and curing conditions will vary from situation to situation,recommended starting ranges are shown above.StorageStore product in the unopened container in a dry location.Storage information may be indicated on the product containerlabeling.Powder Storage - Powder or preforms should be stored at 5oC or below, in closed containers.
After removal from coldstorage, the material MUST be allowed to come to roomtemperature, in the sealed container, to avoid moisture contamination.
The suggested waiting time for a standard 15kg carton box is 24 hours
KL-G800H環氧樹脂成型復合材料適用于不含阻燃劑的引線封裝。
該材料設計達到JEDEC二級要求，260°起流溫度. KL-G800H符合UL 94 V-0易燃性3.175mm厚度。固化材料的特性：175°C，秒28螺旋流，@ 175°C，cm 115Shelf壽命：@5oC，月6個工藝流程數據處理預熱溫度：常規模具，℃80至100Automold，秒0至5模具溫度，℃150至195壓鑄壓力，Kg /cm240至100轉印時間：常規模具，秒10至15Automold，秒4至10℃時間，175℃，秒：常規模具，70至120Automold，70至90固化175℃，小時4至6華為KL-G800H已經被制定為盡可能提供*好的可塑性和寬的成型緯度。
雖然模具和固化條件將因情況而異，但推薦的起始范圍如上所示。
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