HYSOL GR15F-1電子膠水/塑封膠水/漢高樂泰膠水/塑封方案
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Product temperature HYSOL GR15F-1 Description Acid anhydride curing molding compound with spherical packing designed for applications requiring high pressure, high power and / or high temperature performance.
Thermal conductivity 0.85 W / Mk MSL L1 / 260 ° C Linear flow, cm 80 Hot plate Glue time, seconds 28 filled content% 75 CTEa1, ppM / ℃ 18 Tg, 210
main features for high pressure applications
產(chǎn)品℃HYSOL GR15F-1 描述 酸酐固化塑封料含球形填料,設計適用于需 要高壓、高功率和 / 或高溫性能的應用.
導熱率0.85 W/Mk MSL L1/260℃ 線性流 動,厘米 80 熱板凝膠 時間,秒 28 填充含 量 % 75 CTEa1, ppM/℃ 18 Tg, 210
主要特點 適用于高壓應用 |
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