HYSOL KL-G800H電子膠水/塑封膠水/漢高樂泰膠水/塑封方案
技術服務熱線：021-51693135 / 021-22818476
KL-G800H epoxy molding compound is suitable forthin leaded package without any flame retardant..
This materialis designed to achieve JEDEC Level 2 requirements, at 260°C eflow temperature.
KL-G800H meets UL 94 V-0 Flammability at 3.175mmthickness.
TYPICAL PROPERTIES OF UNCURED MATERIALGel Time @ 175 °C, seconds 28Spiral Flow, @ 175°C, cm 115Shelf Life:@ 5oC, months 6TYPICAL PROCESS DATAHandling
Preheat Temperature :Conventional mold, °C 80 to 100Automold, seconds 0 to 5Molding Temperature, °C 150 to 195Molding Pressure, Kg/cm2 40 to 100Transfer Time:Conventional mold, seconds 10 to 15Automold, seconds 4 to 10Curing Time, @ 175oC, seconds:Conventional mold, 70 to 120Automold, 70 to 90Post Cure @ 175°C, hours 4 to 6Huawei KL-G800H has been formulated to provide the best possiblemoldability and as wide a molding latitude as possible.
Althoughmoldingand curing conditions will vary from situation to situation,recommendedstarting ranges are shown above.
KL-G800H環氧樹脂成型復合材料適用于不含阻燃劑的引線封裝。
該材料設計達到JEDEC二級要求，溫度為260°C回流溫度。
KL-G800H符合UL 94 V-0易燃性3.175mm厚度。固化材料的典型特性凝膠時間@ 175°C秒秒28螺旋流@ 175°C，115°冰箱壽命：@5oC，月份6工藝流程數據處理預熱溫度：常規模具，80至100Automold，秒0至5模具溫度，℃150至195模壓壓力，Kg / cm 2 40至100轉印時間：常規模具秒10至15Auoldold秒秒4至10℃恒定時間@ 175℃，秒：常規模具，70至120Automold，70至90固化175℃，小時4至6小時KL-G800H已經配制，以提供盡可能*好的可塑性和寬的成型緯度。
雖然模具和固化條件因情況而異，但推薦的開始范圍如上所示。 |
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