漢高漢高樂泰樂泰 Eccobond DX-20C
技術服務熱線：021-51693135 / 021-22818476
樂泰 ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Cone & Plate, mPa∙s (cP):
@ 25°C Speed 10 rpm 12,000
Specific Gravity 1.17
Work Life @ 25°C, days 5
Shelf Life @ -20°C, months 6
Flash Point - See SDS
TYPICAL CURING PERFORMANCE
Cure Schedule
1 hour @ 170°C
Time shown does not include ramp-up time to cure temperaure.
The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary based on customers' experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.
TYPICAL PROPERTIES OF CURED MATERIAL
Physical Properties :
Moisture Absorption @ Saturation, wt.%,
60oC/90% RH exposure for 24 hrs
0.6
TYPICAL PERFORMANCE OF CURED MATERIAL
Cured at 170°C for 1 hour
Die Shear Strength :
1.25 x 1.25 mm Si die on Ag plated Cu, N
@ 25°C
125
1.25 x 1.25 mm Si die on Ag plated Cu, N
@ 160°C
49
dx20c絕緣膠樂泰 ABLESTIK提供優良的粘合強度，特別是在引線鍵合過程中溫度降低裝配缺陷率。它具有強大的熱/紫外線電阻，可應用于引腳轉移，沖壓和配藥。
固化材料的典型性能
粘度、錐板、MPA∙S（CP）：
@ 25°C轉速10轉12000
比重1.17
工作生活@ 25°C，天5
保質期@ 20°C，月6
閃點-見SDS
典型的固化性能
治療計劃
1小時@ 170°C
時間顯示不包括升溫時間的固化溫度。
上述固化型材指南建議。固化條件（時間和溫度）可能會根據客戶的經驗和他們的應用要求，以及客戶固化設備，烘箱負荷和實際烤箱溫度變化。
固化材料的典型性能
物理性質：
水分吸收@飽和度，重量%，
60oC / 90% RH暴露24小時 |
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