漢高漢高樂泰樂泰 貼片紅膠Chipbond 3616
技術(shù)服務(wù)熱線：021-51693135 / 021-22818476
樂泰 3616
樂泰 3616 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited to printing a range of dot heights with one stencil thickness and where high wet strength characteristics, and high print speeds are required.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.33
Yield Point, 25 °C, Pa
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone
250 to 650LMS
Casson Viscosity @ 25 °C, Pa∙s
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone
15 to 55
Flash Point - See SDS
TYPICAL CURING PERFORMANCE
Recommended conditions for curing are exposure to heat above 100 °C (typically 90-120 seconds @ 150 °C). Rate of cure and final strength will depend on the residence time at the cure temperature.
Cure Speed vs. Time, Temperature
The following graph shows the rate of torque strength developed with time at different temperatures. These times are defined from the moment the adhesive reaches cure temperature. In practice, total oven time may be longer to allow for heat up period. Strength is measured on 1206 capacitors @ 22 °C, tested according to IPC SM817, TM-650 Method 2.4.42.
樂泰3616是專為表面粘接安裝設(shè)備的印刷電路板波峰焊接之前。特別適合于印刷一系列的網(wǎng)點高度與一個模板厚度和高濕強度特性，和高打印速度是必需的。
固化材料的典型性能
比重@ 25°C 1.33
屈服點，25°C，PA
錐板流變儀：
哈克PK 100，M10 / PK 1 2°錐
250 650lms
卡森粘度@ 25°C，PA的∙
錐板流變儀：
哈克PK 100，M10 / PK 1 2°錐
15到55
閃點-見SDS
典型的固化性能
治療建議的條件是熱暴露100以上°C（通常是90-120秒@ 150°C）。固化速率和*終強度將取決于固化溫度的停留時間。
固化速度與時間、溫度
不同溫度下扭矩強度隨時間的變化。這些時間被定義從粘合劑到達固化溫度的時刻。在實踐中，總烤箱時間可能會更長，以允許升溫期間。強度是1206電容器”22°C測量，根據(jù)IPC sm817測試方法，tm-650 2.4.42。 |
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