SIM7100C-PCIE|無線模塊|SIM7100C-PCIE
SIM7100C-PCIE
Multi-band TDD-LTE/FDD-LTE/TD-SCDMA/WCDMA/GSM/GNSS
Dimensions:50.95*32*4.95 mm
Operation Temp:-40°C to +85 °C
SIM7100C|無線模塊|SIM7100C
SIM7100C
Multi-band TDD-LTE/FDD-LTE/TD-SCDMA/WCDMA/GSM/GNSS
尺寸:30*30*2.9 mm
工作溫度:-40°C to +85 °C
SIM800H|無線模塊|SIM800H
SIM800H
全新LGA 封裝
•超小尺寸:15.8*17.8*2.4 mm
•GPRS multi-slot class 12
•超低功耗,待機電流小于0.7mA
SIM800L|無線模塊|SIM800L
SIM800L
全新LGA 封裝
•超小尺寸:15.8*17.8*2.4 mm
•GPRS multi-slot class 12
•超低功耗,待機電流小于0.7mA
•高接收靈敏度,找網能力強
SIM68V|無線模塊|
SIM68V
Dimensions: 16*12.2*2.7mm
Weight: 1g
Operation temperature5 -40℃ to +85 ℃
SIM68|無線模塊|SIM68
SIM68
Technology:GPS/GLONASS
Dimensions:15*13*2.4 mm
NormalTemp:-40℃ to +85℃
SIM6216|無線模塊|SIM6216
SIM6216
技術支持:Single-Band CDMA-EVDO
外形尺寸:45.5 X 26X 3 mm
溫度:-30℃ to +80℃
SIM5216|無線模塊|
SIM5216
支持電壓范圍:3.3V~ 4.2V
操作溫度范圍:-30 ℃ to +80 ℃
尺寸:36*26*4.7mm
重量:7g
SIM5320|無線模塊|
SIM5320
技術平臺:Quad-Band GSM/GPRS/EDGE 850/900/1800/1900MHz
工作溫度: -30℃ to +85℃
外形尺寸: 30 * 30* 2.9g
重量: 5.6
MC52i/MC55i|無線模塊|MC52i/MC55i
MC52i/MC55i
技術平臺: 雙頻/四頻GSM/GPRS
外形尺寸: 35 x 32.5 x 3.1mm
工作溫度: -20°C to +55°C
連接方式: 板對板連接 |
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